无铅再流焊接BGA球窝缺陷研究

球窝现象是密间距BGA、CSP类器件在无铅再流焊接中经常发生的一种高发性缺陷.在现场案例解剖、分析获取的数据和分析资料的基础上,根据其所表现的物理特征对球窝现象进行了分类.并基于密间距PBGA、CSP在再流焊接过程中所发生的物化现象,对其形成机理进行了研究和试验,在此基础上初步探讨了抑制此现象的对策.

Study on Pillow Effect in Lead-Free Reflow Process

Pillow-head effect is often discovered on fine pitch BGA/CSP in lead-free assembly process.Classify the effect based on physical character,study and experiment to find the cause of the formation of pillow-head effect,advise how to restrain the effect.All of these is based on the physical and chemical phenomena of fine pitch BGA/CSP assembly.