| 真空烧结在电子组装中的应用技术 |
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| 引用本文： | 张世伟.真空烧结在电子组装中的应用技术[J].电子工艺技术,2011,32(3):156-159. |
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| 作者姓名： | 张世伟 |
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| 作者单位： | 中国电子科技集团公司第二研究所; |
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| 摘 要： | 针对功率混合集成电路中传统电子功率元件组装技术存在的主要问题,介绍了新的组装工艺设备,阐述了功率芯片真空烧结关键工艺参数及组装中的工装要求,列举了典型工装夹具实例,同时对ZSH-型真空烧结炉设备的组成、功能及特性进行了详细介绍.
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| 关 键 词： | 微组装 功率元件 真空烧结 |
Application of Vacuum Sintering to Electronic Assembly |
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| ZHANG Shi-wei.Application of Vacuum Sintering to Electronic Assembly[J].Electronics Process Technology,2011,32(3):156-159. |
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| Authors: | ZHANG Shi-wei |
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| Affiliation: | ZHANG Shi-wei(The Second Research Institute of CETC,Taiyuan 030024,China) |
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| Abstract: | Introduce new assembly process equipment based on the disadvantages of traditional electronic power component assembly technology in Power Hybrid IC.Expound the key process parameters of power IC vacuum sintering and fixture/tooling requirements in assembly.Enumerate the typical examples of fixture/tooling.Also introduce the Composition,function and characteristic of ZSH-model vacuum sintering oven. |
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| Keywords: | Micro-assembly Power component Vacuum sintering |
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