| 氮气保护无铅波峰焊焊接质量分析 |
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| 引用本文： | 史建卫,宋耀宗.氮气保护无铅波峰焊焊接质量分析[J].电子工艺技术,2011,32(3):185-187. |
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| 作者姓名： | 史建卫 宋耀宗 |
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| 作者单位： | 日东电子科技(深圳)有限公司; |
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| 摘 要： | 相对于传统的Sn-Pb焊料,无铅焊料更容易氧化,润湿性较差,从而影响波峰焊接质量.N2保护可以降低无铅焊料的氧化,提高无铅焊料的润湿性,从而提高波峰焊接质量.从润湿性的机理分析了N2保护提高无铅焊料润湿性的原因,并通过润湿性实验和波峰焊接试验证实了N2保护的优越性.
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| 关 键 词： | N2保护 无铅焊料 波峰焊 润湿性 |
Lead-free Wave Soldering Quality Analyzing in Nitrogen |
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| SHI Jian-wei,SONG Yao-zong.Lead-free Wave Soldering Quality Analyzing in Nitrogen[J].Electronics Process Technology,2011,32(3):185-187. |
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| Authors: | SHI Jian-wei SONG Yao-zong |
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| Affiliation: | SHI Jian-wei,SONG Yao-zong(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China) |
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| Abstract: | Lead-free solder alloys are more easily oxygenized and have poor wettability comparing with traditional Sn-Pb solder alloys,which affects joints reliabilities of wave soldering.The oxidation of lead-free solder alloys can be prevented and the wettability of lead-free solder alloys can be improved in nitrogen environment,which increases joints reliabilities of wave soldering.Lead-free solder alloys wettability mechanism was analyzed and the effects of nitrogen protection were substantiated by wettability and... |
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| Keywords: | Nitrogen protection Lead-free solder alloys Wave soldering Wettability |
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