无铅工艺和有铅工艺

随着国际环保要求逐步提高,无铅工艺成为电子产业发展的一个必然过程。详细介绍了有铅工艺和无铅工艺的焊料合金成分、焊料成本、焊料合金熔点温度、焊料合金可焊性、焊焊接后出现的各种故障现象和焊接工艺特点,同时指出了有铅和无铅工艺对电子元器件和PCB要求的不同点,指出了它们的利弊以及使用设备的通用性。

Discussion of Lead-free and Lead Technics

With the development of enviromental protection,lead-free process has become an inevitable trend in electronics industry.Introduce the solder alloy,solder cost,soldering temperature,solderability,soldering defects and soldering process characteristic of lead-free and lead technics in details.Point out the different requirements of lead-free and lead technics for components and PCB,give out the advantages and disadvantages of each process and the universal properties of the equipment.