| 银粉形貌与尺寸对导电胶电性能的影响 |
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| 引用本文： | 熊胜虎,杨荣春,吴丹菁,郑东风,田民波.银粉形貌与尺寸对导电胶电性能的影响[J].电子元件与材料,2005,24(8):14-16. |
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| 作者姓名： | 熊胜虎 杨荣春 吴丹菁 郑东风 田民波 |
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| 作者单位： | 清华大学材料科学与工程系,北京,100084;振华亚太高新电子材料有限公司,贵州,贵阳,550018 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 从导电性角度考查银粉颗粒形貌和粒径大小对导电胶电阻率的影响。用不同形貌和不同平均粒径的银粉,按相同配方制成导电胶,比较其体电阻率。结果发现不同形貌的银粉体系的电阻率存在数量级上的差异;填充片状银粉的体系电阻率与银粉平均粒径成反比,在5~12μm内,平均粒径越大电阻率越低。
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| 关 键 词： | 电子技术 导电胶 银粉形貌 银粉尺寸 电阻率 |
| 文章编号： | 1001-2028(2005)08-0014-03 |
Effects of Morphologies and Size of Ag Particle on Electrical Performance of Conductive Adhesive |
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| XIONG Sheng-hu,YANG Rong-chun,WU Dan-jing,ZHENG Dong-feng,TIAN Min-bo.Effects of Morphologies and Size of Ag Particle on Electrical Performance of Conductive Adhesive[J].Electronic Components & Materials,2005,24(8):14-16. |
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| Authors: | XIONG Sheng-hu YANG Rong-chun WU Dan-jing ZHENG Dong-feng TIAN Min-bo |
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| Abstract: | The effects of silver particles morphologies and size on the electrical bulk resistivity of conductive adhesive were described. By different Ag powder with different morphologies and average diameter, their resistivities were compared in the same resin system. The results indicate that the morphologies influences resistivity greatly, where a distinction exists in exponential value between the different Ag powder. Furthermore, resistivity inverses with the particle size in the flake powder filled system. When the average diameter increases in the region of 5~12 μm, resistivity decreases. |
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| Keywords: | electronic technology conductive adhesive morphologies particle size resistivity |
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