| 微量元素改性Sn-0.7Cu系无铅钎料的研究进展 |
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| 引用本文： | 李广东,史耀武,夏志东,雷永平.微量元素改性Sn-0.7Cu系无铅钎料的研究进展[J].电子元件与材料,2009,28(2). |
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| 作者姓名： | 李广东 史耀武 夏志东 雷永平 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124 |
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| 基金项目： | 国家科技支撑重点项目 |
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| 摘 要： | 微量元素改性Sn-0.7Cu系无铅钎料的性能有所提高,添加的微量元素主要有Ni、Ce、P和Ge等,重点介绍了微量元素的添加对钎料显微组织和性能的影响。该系无铅钎料的润湿性能和一般力学性能仍与传统的SnPb钎料具有一定的差距。因此,寻找恰当的微量元素,开发出具有综合性能优良的Sn-0.7Cu系无铅钎料将成为未来无铅钎料的重要研究方向之一。
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| 关 键 词： | 无铅钎料 Sn-0.7Cu 综述 改性 |
Research progress of Sn-0.7Cu system lead-free solder modified by microelements |
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| LI Guangdong,SHI Yaowu,XIA Zhidong,LEI Yongping.Research progress of Sn-0.7Cu system lead-free solder modified by microelements[J].Electronic Components & Materials,2009,28(2). |
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| Authors: | LI Guangdong SHI Yaowu XIA Zhidong LEI Yongping |
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| Affiliation: | School of Materials Science & Engineering;Beijing University of Technology;Beijing 100124;China |
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| Abstract: | The properties of the Sn-0.7Cu system lead-free solder are improved by adding trace elements. The main trace elements are Ni, Ce, P, Ge, etc. Effect of the trace element addition on microstructure and properties of the solders was introduced. However, the wettability and conventional mechanical properties of the Sn-0.7Cu system lead-free solder are hard to match with the traditional SnPb solder. Therefore, it is a important study direction for the future to search adaptive trace elements and develop a Sn-0.... |
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| Keywords: | Sn-0 7Cu |
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