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高导热金刚石/玻璃复合材料的制备和性能研究
引用本文:童震松,沈卓身,张毓隽.高导热金刚石/玻璃复合材料的制备和性能研究[J].电子元件与材料,2009,28(11).
作者姓名:童震松  沈卓身  张毓隽
作者单位:北京科技大学,材料科学与工程学院,北京,100083
摘    要:首先对金刚石颗粒进行化学镀Cu,并控制氧化,从而在金刚石颗粒表面获得Cu-Cu2O复合结构。然后,在800℃无压烧结制备了金刚石/玻璃复合材料,观察了其表面和界面形貌,并测定了其相对密度和热导率。结果表明,通过对镀Cu金刚石的控制氧化,明显改善了玻璃对金刚石颗粒表面的润湿性,避免了玻璃对金刚石颗粒表面的侵蚀,提高了复合材料的热导率;复合材料的热导率随金刚石含量的增加而增加,当金刚石质量分数为70%时,热导率最高达到了14.420W/(m·K)。

关 键 词:复合材料  金刚石  玻璃  热导率  化学镀铜  电子封装

Preparation and properties of diamond/glass composite materials with high thermal conductivity
TONG Zhensong,SHEN Zhuoshen,ZHANG Yujuan.Preparation and properties of diamond/glass composite materials with high thermal conductivity[J].Electronic Components & Materials,2009,28(11).
Authors:TONG Zhensong  SHEN Zhuoshen  ZHANG Yujuan
Abstract:Diamond particles were electroless plated with copper firstly. After a controlled oxidation process, the Cu-Cu_2O structure formed on the surface of diamond particles. Then diamond/glass composite materials were prepared through pressureless sintering at 800 ℃. The surface and interface morphology of prepared composite materials were observed, and the relative density and thermal conductivity were measured. The results show that the controlled oxidation significantly improves the wettability while avoids the erosion of molten glass to the surface of diamond particles. Therefore, the thermal conductivity of the composite materials increases. The thermal conductivity of composite materials increases with increasing diamond content and reaches the maximum value of 14.420 W/(m·K) when the mass faction of diamond is 70%.
Keywords:composite material  diamond  glass  thermal conductivity  electroless copper plating  electronic packaging
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