| 微量RE和Al对Sn-9Zn焊料组织与性能的影响 |
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| 引用本文： | 吕娟,赵麦群,王秀春,康晶.微量RE和Al对Sn-9Zn焊料组织与性能的影响[J].电子元件与材料,2009,28(8). |
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| 作者姓名： | 吕娟 赵麦群 王秀春 康晶 |
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| 作者单位： | 西安理工大学,材料科学与工程学院,陕西,西安,710048 |
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| 基金项目： | 陕西省自然科学研究计划资助项目(No.2002E111) |
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| 摘 要： | 采用正交试验研究了微量RE和Al对Sn-9Zn无铅焊料电导率、硬度、润湿性及微观组织的影响,并与传统锡铅焊料进行了对比。Sn-9Zn焊料的电性能及力学性能优于传统锡铅焊料,但润湿性较差。添加微量RE和Al可以显著提高Sn-9Zn合金铺展率、细化组织,且不降低焊料电导率和力学性能,最佳w(RE)和w(Al)分别为0.05%和0.10%,铺展率达到61.98%,与Sn-9Zn相比提高了13.40%,硬度为20.90HB,电导率为8.15×106S/m。
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| 关 键 词： | 无铅焊料 Sn-9Zn RE Al 铺展率 微观组织 |
Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn |
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| Lü Juan,ZHAO Maiqun,WANG Xiuchun,KANG Jing.Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn[J].Electronic Components & Materials,2009,28(8). |
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| Authors: | Lü Juan ZHAO Maiqun WANG Xiuchun KANG Jing |
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| Abstract: | By means of electric conductivity meter, Brinell hardness tester and optical microscope, effects of addition of RE and Al to Sn-9Zn lead-free solder on its conductivity, hardness, wetting property and the microstructure were analyzed through orthogonal experiment. Meanwhile, comparative tests with traditional Sn-Pb solder were studied. The results show that Sn-9Zn solder has better electrical property and mechanical property, but wetting property is worse, compared with traditional Sn-Pb solder. Trace RE an... |
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| Keywords: | lead-free solder Sn-9Zn RE Al spreading ratio microstructure |
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