| 金属薄膜附着性的改进 |
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| 引用本文： | 滕林,杨邦朝,崔红玲,杜晓松.金属薄膜附着性的改进[J].电子元件与材料,2003,22(6):41-44. |
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| 作者姓名： | 滕林 杨邦朝 崔红玲 杜晓松 |
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| 作者单位： | 电子科技大学微电子与固体电子学院,四川,成都,610054 |
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| 基金项目： | 军事电子预研基金资助项目(AW030412) |
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| 摘 要： | 根据薄膜附着机理,综述了影响金属薄膜附着性的因素。通过引入中间过渡层,减少应力来提高薄膜与衬底之间的结合强度,改善金属薄膜的性能。适当的热处理不仅能消除内应力,增强界面反应,而且对薄膜的性能有一定的影响。
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| 关 键 词： | 金属薄膜 附着性 应力 中间过渡层 热处理 |
| 文章编号： | 1001-2028(2003)06-0041-04 |
Improvement of Adhesion between Metallic Films and Substrates |
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| TENG Lin,YANG Bang-chao,CUI Hong-ling,DU Xiao-song.Improvement of Adhesion between Metallic Films and Substrates[J].Electronic Components & Materials,2003,22(6):41-44. |
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| Authors: | TENG Lin YANG Bang-chao CUI Hong-ling DU Xiao-song |
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| Abstract: | Based on the mechanism of film adhesion, the factors influencing the adhesion between films and substrates are briefly reviewed. The binding strength of the films can be improved by decreasing the stress between the film and the substrate with an interlayer inserted in between. The performance of the metallic film can also be improved in this way. By proper heat treatment, inner stress can be eliminated, interface reaction can be enhanced and the metallic film performances can be influenced. |
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| Keywords: | metallic films adhesion stress interlayer heat treatment |
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