| SnAgCuY钎料表面Sn晶须的旋转生长现象 |
| |
| 引用本文： | 郝虎,李广东,史耀武,夏志东,雷永平.SnAgCuY钎料表面Sn晶须的旋转生长现象[J].电子元件与材料,2008,27(11). |
| |
| 作者姓名： | 郝虎 李广东 史耀武 夏志东 雷永平 |
| |
| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022 |
| |
| 摘 要： | 研究了Sn3.8Ag0.7Cu1.0Y钎料表层上YSn3稀土相表面Sn晶须的生长行为。结果表明:室温时效条件下在YSn3的表面会出现Sn晶须的快速生长现象,生长速度最快可达10–10m/s,长度最长可达200μm。YSn3稀土相氧化的不均匀性是导致Sn晶须在生长时产生各种旋转现象的主要原因。
|
| 关 键 词： | 金属材料 Sn晶须 无铅钎料 SnAgCuY钎料 |
Rotational growing phenomena of Sn whiskers on SnAgCuY solder surface |
| |
| HAO Hu,LI Guang-dong,SHI Yao-wu,XIA Zhi-dong,LEI Yong-ping.Rotational growing phenomena of Sn whiskers on SnAgCuY solder surface[J].Electronic Components & Materials,2008,27(11). |
| |
| Authors: | HAO Hu LI Guang-dong SHI Yao-wu XIA Zhi-dong LEI Yong-ping |
| |
| Affiliation: | HAO Hu,LI Guang-dong,SHI Yao-wu,XIA Zhi-dong,LEI Yong-ping (School of Materials Science & Engineering,Beijing University of Technology,Beijing 100022,China) |
| |
| Abstract: | Researched the Sn whiskers growth behavior was on the surface of YSn3RE-phase on Sn3.8Ag0.7Cu1.0Y solder. Results show that there appears rapid growth of tin whiskers with growth rate up to 10–10 m /s and length up to 200 μm on the surface of YSn3RE-phase under room-temperature aging. YSn3RE-phase unequal oxidation is main reason to result in rotational phenomena of Sn whisker growing. |
| |
| Keywords: | metallic material Sn whiskers lead-free solder SnAgCuY solder |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
