| 回流焊对SnAgCuBi/Cu焊点IMC及剪切强度的影响 |
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| 引用本文： | 权延慧,孙凤莲,王丽凤,刘洋.回流焊对SnAgCuBi/Cu焊点IMC及剪切强度的影响[J].电子元件与材料,2009,28(7). |
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| 作者姓名： | 权延慧 孙凤莲 王丽凤 刘洋 |
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| 作者单位： | 哈尔滨理工大学,材料科学与工程学院,黑龙江,哈尔滨,150080 |
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| 基金项目： | 国家自然科学基金资助项目，哈尔滨市科技创新人才研究专项资金资助项目 |
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| 摘 要： | 利用金相显微镜和扫描电镜对多次回流焊后的Sn-0.3Ag-0.7Cu-xBi/Cu焊点IMC和剪切断口形貌进行了观察和分析。结果表明:Bi的加入提高了接头剪切强度,且随着Bi含量的增加而增加,当w(Bi)为4.5%时达最大值45.07MPa,同时Bi的加入有效抑制了焊点IMC的增长。经过5次回流焊后,未加入Bi的焊点剪切强度由24.55MPa下降到20.82MPa,而加入w(Bi)为3.0%的焊点剪切强度由35.95MPa下降到32.46MPa。
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| 关 键 词： | 回流焊 Sn-0.3Ag-0.7Cu-xBi钎料 剪切强度 IMC |
Effect of reflow soldering on the IMC and shear strength of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints |
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| QUAN Yanhui,SUN Fenglian,WANG Lifeng,LIU Yang.Effect of reflow soldering on the IMC and shear strength of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints[J].Electronic Components & Materials,2009,28(7). |
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| Authors: | QUAN Yanhui SUN Fenglian WANG Lifeng LIU Yang |
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| Affiliation: | School of Material Science & Engineering;Harbin University of Science and Technology;Harbin 150080;China |
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| Abstract: | The morphology of the intermetallic compound (IMC) and the shear fracture surface of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints, which have experienced several cycles of reflow soldering, were observed by scanning electron microscope (SEM) and metallurgical microscope. The results show that the shear strength of Sn-0.3Ag-0.7Cu/Cu solder joints is enhanced by the introduction of Bi and increases with increasing Bi content, with the largest shear strength of 45.07 MPa being reached at a Bi content of 4.5% (mass frac... |
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| Keywords: | IMC |
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