醇胺对免清洗焊芯用助焊剂性能的影响

通过添加醇胺制备免清洗焊芯用助焊剂,研究了两种醇胺及其复配对助焊剂性能的影响。结果表明:添加适当的醇胺有利于降低助焊剂体系酸值,提高焊接性能,减少对线路板的腐蚀,提高焊接可靠性。使用任意一种醇胺,质量分数在1.0%~1.5%时,助焊剂的焊接性能较好,但酸值不能满足免清洗助焊剂的要求。两种醇胺进行复配,质量分数均为1.0%~1.5%时,助焊剂的综合性能优良,用无铅焊锡丝SnAg3.0Cu0.5测定其焊接性能,扩展率为79%,酸值148 mgKOH/g,铜板腐蚀、绝缘电阻、电迁移等可靠性指标较好。

Effects of alkylol amine on performance of free-cleaning flux of cored wire

The free-cleaning solder-core flux was prepared by adding alkylol amine.Effects of two alkylol amines and their combination on performance of the flux were studied.The results show that addition of appropriate moment of alkylol amines is beneficial to reduce acid value of the flux system,enhances the welding performance,reduces the circuit board corrosion and improves the welding reliability.The use of any kind of alkylol amines,mass fraction in 1.0%-1.5%,is better for soldering performance of the flux,but the acid value cannot meet the requirements of free-cleaning flux.When two kinds of alkylol amines are compounded and mass fractions are 1.0%-1.5%,the comprehensive performance of the flux is fine.When its soldering performance is determined by the use of lead-free solder wire of SnAg3.0Cu0.5,the spreading rate is 79%,the acid value is 148 mgKOH/g,the reliability indexes such as Cu board corrosion,insulation resistance and electromigration etc.are excellent.