| 锡基无铅钎料的性能研究与新进展 |
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| 引用本文： | 杨磊,揭晓华,郭黎.锡基无铅钎料的性能研究与新进展[J].电子元件与材料,2010,29(8). |
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| 作者姓名： | 杨磊 揭晓华 郭黎 |
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| 作者单位： | 1. 广东工业大学,广东,广州,510006
2. 高新锡业(惠州)有限公司,广东,惠州,516123 |
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| 基金项目： | 粤港关键领域重点突破招标资助项目 |
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| 摘 要： | 介绍了现阶段锡基无铅钎料的使用和生产情况,归纳了钎料合金的特点,综述了不同系列无铅钎料的熔化特性、焊后的剪切强度及可焊性等,总结了目前无铅钎料研究所取得的新成果、新进展以及存在的问题。从锡晶须,虚焊等方面指出了无铅钎料可靠性的不足,并提出部分解决方案,指出了无铅钎料的发展趋势和应用前景。
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| 关 键 词： | 无铅钎料 钎料合金 综述 可靠性 |
Performance research and new development of tin-based lead-free solder |
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| YANG Lei,JIE Xiaohua,GUO Li.Performance research and new development of tin-based lead-free solder[J].Electronic Components & Materials,2010,29(8). |
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| Authors: | YANG Lei JIE Xiaohua GUO Li |
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| Affiliation: | YANG Lei1,JIE Xiaohua1,GUO Li2(1.Guangdong University of Technology,Guangzhou 510006,China,2.Gaoxin Stannum Industry(Huizhou) Co.,Ltd,Huizhou 516123,Guangdong Province,China) |
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| Abstract: | The use and production of the tin-based lead-free solder are introduced and the characteristics of the solder alloy is summed up.Soldering characteristics,shear strength after soldering and some other properties of different series of lead-free solders are discussed.New achievements,progresses and some problems existing in lead-free solders research are summarized.Shortcomings of the reliability of lead-free solders are pointed out from the aspects of tin whiskers and poor soldering joint.Some relevant solu... |
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| Keywords: | lead-free solder solder alloy review reliability |
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