低温共烧陶瓷(LTCC)介质的材料科学与设计策略

低温共烧陶瓷(LTCC)介质是无源集成和系统级封装技术的关键材料。由于烧结工艺上的特殊要求,这类材料具有较传统电子陶瓷更复杂的显微结构,在材料的设计上难度更大。从材料的组成、结构、形成机制及其性质之间的关系出发,分析了探索新型LTCC介质材料的关键因素和设计策略,并通过对以作者研究组成功设计出的新型低介电常数LTCC材料——硅铝氟氧化物基LTCC介质为典型案例的剖析,论证了基于材料科学的基本原理实现对LTCC介质进行设计的可行性。

Material science and design strategies of low-temperature co-fired ceramic (LTCC) dielectrics

Low temperature co-fired ceramic(LTCC) dielectrics are key materials for the passive integration and system-in-package(SIP) techniques.Due to the special requirements in sintering process,these materials possess much more complex structures and are more difficult to be designed in material,compared with conventional electronic ceramics.In this paper,important factors and design strategies for the development of new LTCC dielectrics are proposed.As a successful example,the design of oxyfluoride glass-ceramic based dielectrics,a new class of LTCC materials with low ε r,is analyzed.And,the feasibility of the design of LTCC dielectrics,based on the principles of material science,is discussed.