| T/R组件基板电极区的互连可靠性 |
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| 引用本文： | 王立春,吴毓颖,陈靖,曹向荣.T/R组件基板电极区的互连可靠性[J].电子元件与材料,2012,31(7):63-66. |
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| 作者姓名： | 王立春 吴毓颖 陈靖 曹向荣 |
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| 作者单位： | 上海航天电子技术研究所,上海,201109 |
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| 摘 要： | 采用化学镀Ni/Pd/Au新工艺制作了T/R组件基板电极区,对比研究了在化学镀Ni/Au基板和Ni/Pd/Au基板上引线键合和钎焊的性能。结果显示:化学镀Ni/Pd/Au基板经过200℃烘烤处理6 h后,φ25μm金丝的引线键合强度大于0.08 N(8 gf),0402元件的焊点剪切强度大于4.9 N(500 gf),引线键合和钎焊性能均优于化学镀Ni/Au基板,有效地提高了T/R组件互连可靠性。
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| 关 键 词： | T/R组件 电极区 化学镀 互连可靠性 |
Interconnection reliability on substrate pads for T/R modules |
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| WANG Lichun
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WU Yuying
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CHEN Jing
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CAO Xiangrong.Interconnection reliability on substrate pads for T/R modules[J].Electronic Components & Materials,2012,31(7):63-66. |
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| Authors: | WANG Lichun WU Yuying CHEN Jing CAO Xiangrong |
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| Affiliation: | (Shanghai Aerospace Electronic Technology Institute,Shanghai 201109,China) |
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| Abstract: | Applied the new process of electroless Nickel/Palladium/Gold finishing,the substrate pads for T/R modules were fabricated.The properties of wire bonding and solder bonding on electroless Nickel/Gold and Nickel/Palladium/Gold substrates were compared and studied.The results indicate that when electroless Nickel/Palladium/Gold substrate is baked at 200 ℃ for 6 h,25 μm gold wire bonding strength is greater than 0.08 N(8 gf),the solder joint shear strength of 0402 components is greater than 4.9 N(500 gf),and interconnection reliability performance is better than that of electroless Nickel/Gold,the interconnection reliabilities of T/R modules are effectively increased. |
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| Keywords: | transmit/receive module electrode pads electroless finishing interconnection reliability |
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