| 低温烧结微波介质陶瓷 |
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| 引用本文： | 赵梅瑜,王依琳.低温烧结微波介质陶瓷[J].电子元件与材料,2002,21(2):30-33,39. |
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| 作者姓名： | 赵梅瑜 王依琳 |
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| 作者单位： | 中科院上海硅酸盐研究所,上海,200050 |
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| 摘 要： | 在制备多层微波元件过程中,为使用Cu、Ni等低熔点导体,必须降低微波介质陶瓷的烧结温度。本文介绍了通过液相烧结降低致密化温度的BaTi4O9、Ba2Ti9O20及(Zr,Sn)TiO4陶瓷,这类材料的烧结温度已降至1 000℃以下;也介绍了掺加(V2O3+CuO)的BiNbO4基陶瓷,其致密化温度已低至880℃左右。文中还列出了陶瓷组成、低熔点氧化物或玻璃的组成及相关材料的微波介电性能。
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| 关 键 词： | 低温烧结 微波介质陶瓷 液相烧结 |
| 文章编号： | 1001-2028(2002)02-0030-04 |
Low Temperature Firing Microwave Dielectric Ceramics |
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| ZHAO Mei-yu,WANG Yi-lin.Low Temperature Firing Microwave Dielectric Ceramics[J].Electronic Components & Materials,2002,21(2):30-33,39. |
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| Authors: | ZHAO Mei-yu WANG Yi-lin |
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| Abstract: | In the fabrication of multiplayer microwave devices, low temperature firing microwave dielectric materials are needed in order to use the low-melting point conductors such as Cu and Ni etc. The densification temperature of BaTi4O9, Ba2Ti9O20 and (Zr0.8Sn0.2)TiO4 ceramics could be lowered down to 1000℃ via liquid-phase sintering. Besides, BiNbO4 doped with V2O5 and CuO could be densed at about 880℃. The composition of these materials and low melting glass, as well as the microwave dielectric properties are presented. |
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| Keywords: | low temperature firing microwave dielectrics ceramics liquid-phase sintering |
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