| 无铅焊料及其可靠性的研究进展 |
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| 引用本文： | 黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展[J].电子元件与材料,2003,22(4):39-42. |
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| 作者姓名： | 黄惠珍 魏秀琴 周浪 |
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| 作者单位： | 南昌大学化学与材料科学学院,江西,南昌,330047 |
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| 摘 要： | 环保和微电子器件高度集成化的发展驱动了高性能无铅焊料的研究和开发。本文介绍了国内外对Sn-Ag,Sn-Zn,Sn-Bi,Sn-Sb和Sn-In系无铅焊料的发展现状及所取得的研究成果;列出了美国抗高温疲劳焊料研究计划筛选的七种抗热疲劳无铅焊料合金;对焊点的一般可靠性问题及无铅焊料引入的新的可靠性问题进行了归纳和讨论。
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| 关 键 词： | 无铅焊料 疲劳 电迁移 可靠性 |
| 文章编号： | 1001-2028(2003)04-0039-04 |
Progress in the Study on the Lead-free Solder and Its Reliability |
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| HUANG Hui-zhen,WEI Xiu-qin,ZHOU Lang.Progress in the Study on the Lead-free Solder and Its Reliability[J].Electronic Components & Materials,2003,22(4):39-42. |
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| Authors: | HUANG Hui-zhen WEI Xiu-qin ZHOU Lang |
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| Abstract: | The R&D of the lead-free solder of high performance has been pushed forward by the highly developed environment conservation and integrated microelectronic devices. The status of the research on Sn-Ag, Sn-Zn, Sn-Bi, Sn-Sb and Sn-In based lead-free solders are reviewed. Seven reliable lead-free solders recommended by NCMS project, USA are presented. Some common reliability problems in electronic solders and new reliability problems caused by lead-free solders are summarized and discussed. |
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| Keywords: | lead-free solders fatigue electromigration reliability |
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