| 国外微电子组装用导电胶的研究进展 |
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| 引用本文： | 陈党辉,顾瑛,陈曦. 国外微电子组装用导电胶的研究进展[J]. 电子元件与材料, 2002, 21(2): 34-39 |
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| 作者姓名： | 陈党辉 顾瑛 陈曦 |
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| 作者单位： | 西安电子科技大学微电子研究所,陕西,西安,710071 |
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| 摘 要： | 介绍导电胶的组成、分类、较之于传统共晶锡铅焊料的优点以及导电胶的研究现状。重点阐述国外在导电胶导电机理研究、可靠性研究及新型高性能导电胶研制方面的现状和进展。
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| 关 键 词： | 导电胶 导电机理 可靠性 接触电阻 |
| 文章编号： | 1001-2028(2002)02-0034-06 |
Overseas Progress in Electrically Coonducive Adhesives for Microcelectronic Pacjages |
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| CHEN Dang-hui,GU Ying,CHEN Xi. Overseas Progress in Electrically Coonducive Adhesives for Microcelectronic Pacjages[J]. Electronic Components & Materials, 2002, 21(2): 34-39 |
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| Authors: | CHEN Dang-hui GU Ying CHEN Xi |
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| Abstract: | The constitution, classes, advantages and disadvantages of electrically conductive adhesives are brieflyintroduced. Recent advances in the research on electrically conductive adhesives are discussed, with the emphasis on theconduction mechanism, reliability and new electrically conductive adhesives of high performance. |
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| Keywords: | electrically conductive adhesives conduction mechanism reliability contact resistance |
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