| 银粉及电子浆料产品的现状及趋势 |
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| 引用本文： | 赵德强,马立斌,杨君,张春雷. 银粉及电子浆料产品的现状及趋势[J]. 电子元件与材料, 2005, 24(6): 54-56 |
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| 作者姓名： | 赵德强 马立斌 杨君 张春雷 |
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| 作者单位： | 宁夏东方有色金属集团,宁夏东方特种材料科技开发有限责任公司,宁夏,石嘴山,753000;宁夏东方有色金属集团,宁夏东方特种材料科技开发有限责任公司,宁夏,石嘴山,753000;宁夏东方有色金属集团,宁夏东方特种材料科技开发有限责任公司,宁夏,石嘴山,753000;宁夏东方有色金属集团,宁夏东方特种材料科技开发有限责任公司,宁夏,石嘴山,753000 |
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| 摘 要： | 阐述了国内外银粉、电子浆料产品的技术现状和发展趋势。国内的相关产品存在技术落后、产品规模小,研发力量投入不足、技术力量薄弱。国外产品科技含量较高,产品大多达到规模化生产、产品逐渐向高性能、低成本方向发展。不断增长的市场需求及国外公司建厂于中国,对尚在发展中的银粉、电子浆料企业带来前所未有的机遇和挑战。
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| 关 键 词： | 电子技术 银粉 银浆 综述 现状 趋势 |
| 文章编号： | 1001-2028(2005)06-0054-03 |
Resent Situation and Development Trends of Silver Powder and Electronic Paste |
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| ZHAO De-qiang,MA Li-bin,YANG Jun,Zhang Chun-lei. Resent Situation and Development Trends of Silver Powder and Electronic Paste[J]. Electronic Components & Materials, 2005, 24(6): 54-56 |
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| Authors: | ZHAO De-qiang MA Li-bin YANG Jun Zhang Chun-lei |
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| Abstract: | The present situation and trends of silver powder and electronic paste were described. The relative products possess the following characteristics: backward in technique, small in scale, inadequate investment in research and development, lack qualified technical personnel. Abroad, the scientific and technological level is higher. Most of the scales are large. Trend is toward high-performance and low cost. Now, the market demand is increasing. And the foreign corporations are building their factories in China. Which is bringing the chances and challenges to the growing Chinese enterprises to produce silver powder and electronic paste. |
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| Keywords: | electronic technology silver powder silver paste review present situation trend |
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