| 电子封装用SiCp/ZL101复合材料的制备工艺及热膨胀性能 |
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| 引用本文： | 张建云,华小珍,周贤良,孙良新.电子封装用SiCp/ZL101复合材料的制备工艺及热膨胀性能[J].电子元件与材料,2002,21(2):8-9. |
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| 作者姓名： | 张建云 华小珍 周贤良 孙良新 |
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| 作者单位： | 1. 南昌航空工业学院,材料工程系,江西,南昌,330034
2. 南京航空航天大学,江苏,南京,210016 |
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| 摘 要： | 提出了制备电子封装用SiCp/ZL101复合材料渗透法新工艺。该工艺在空气气氛下,于850~950℃温度范围内,不用外加压力,通过助渗剂作用,使铝合金液自动地渗入SiC颗粒间孔隙中,从而形成电子封装用复合材料。并对其热膨胀性能进行了测试。
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| 关 键 词： | 电子封装 金属基复合材料 热膨胀系数 |
| 文章编号： | 1001-2028(2002)02-0008-02 |
| 修稿时间： | 2001年7月31日 |
Technology for SiCp/ZL101 Composite Used for Electronic Packaging and Its Thermal Expansion Characteristics |
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| ZHANG Jian-yun,HUA Xiao-zhen,ZHOU Xian-liang,SUN Liang-xin.Technology for SiCp/ZL101 Composite Used for Electronic Packaging and Its Thermal Expansion Characteristics[J].Electronic Components & Materials,2002,21(2):8-9. |
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| Authors: | ZHANG Jian-yun HUA Xiao-zhen ZHOU Xian-liang SUN Liang-xin |
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| Affiliation: | ZHANG Jian-yun1,HUA Xiao-zhen1,ZHOU Xian-liang1,SUN Liang-xin2 |
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| Abstract: | An infiltration method for making SiCp/ZL101 composite used for electronic packaging is presented. With the technology, by adding infiltrating aids melted aluminum alloy may spontaneously infiltrate in between SiC particles and the composite forms. Its thermal expansion characteristics are tested. |
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| Keywords: | electronic packaging metal-based composite thermal expansion coefficient |
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