| 用于多种组装技术的厚膜导体复合结构 |
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| 引用本文： | 李自学,田树英.用于多种组装技术的厚膜导体复合结构[J].电子元件与材料,1997,16(1):36-40. |
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| 作者姓名： | 李自学 田树英 |
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| 作者单位： | 西安微电子技术研究所 |
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| 摘 要： | 厚膜导体Ｐｄ－Ａｇ／Ａｕ、Ｐｔ－Ｐｄ－Ａｕ／Ａｕ平面复合结构，Ｐｄ－Ａｇ／Ａｕ立体复合结构可使多种组装技术相互兼容。立体复合结构还可有效地降低导体线电阻，减少线损耗。而且，其超声键合性尤佳
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| 关 键 词： | 厚膜电路 导体 复合结构 |
Composite Structure of Thick Film Conductor for Many Assembling Technology |
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| Li Zixue,Tian Shuying.Composite Structure of Thick Film Conductor for Many Assembling Technology[J].Electronic Components & Materials,1997,16(1):36-40. |
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| Authors: | Li Zixue Tian Shuying |
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| Abstract: | A definition of thick film conductor's composite structure is given. Thick film conductor Pd Ag/Au and Pt Pd Au/Au planar composite structure and Pd Ag/Au stereo one make many assembling technology compatible each other. The stereo composite structure may yet effectively reduce conductor's line resistance and line dissipation. It's ultrasonic bonding capability is better. |
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| Keywords: | thick film circuit conductor composite structure |
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