| 电子封装用环氧树脂基复合材料的优化 |
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| 引用本文： | 李攀敏,钟朝位,童启铭,庞祥.电子封装用环氧树脂基复合材料的优化[J].电子元件与材料,2011,30(8):48-51. |
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| 作者姓名： | 李攀敏 钟朝位 童启铭 庞祥 |
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| 作者单位： | 电子科技大学电子薄膜与集成器件国家重点实验室,四川成都,610054 |
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| 摘 要： | 研究了593固化剂不同用量加入电子封装用环氧树脂E-51中的效果,以及在E-51,Al2O3复合材料中硅烷偶联剂不同用量的效果,结果显示:593固化剂与环氧树脂质量比为1:4时,复合材料的致密度高,气孔少,成型效果好；当硅烷偶联剂KH-560质量分数为8%时,复合材料的热导率达到0.75 W/(m·K).
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| 关 键 词： | 电子封装 环氧树脂 复合材料 |
Modification of epoxy resins composites for electronic packaging |
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| LI Panmin,ZHONG Chaowei,TONG Qiming,PANG Xiang.Modification of epoxy resins composites for electronic packaging[J].Electronic Components & Materials,2011,30(8):48-51. |
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| Authors: | LI Panmin ZHONG Chaowei TONG Qiming PANG Xiang |
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| Affiliation: | LI Panmin,ZHONG Chaowei,TONG Qiming,PANG Xiang(State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China) |
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| Abstract: | The effect of different amounts of 593 curing agent on epoxy resin E—51 and silane coupling agent on epoxy resin E—51/Al2O3 composites were studied through experiments.The results show that composites have higher density,less pores and better forming effect when the mass ratio of 593 curing agent and epoxy resin is 1:4.Thermal conductivity of the composite reaches 0.75 W/(m?K) as the mass fraction of KH—560 is 8%. |
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| Keywords: | electronic packaging epoxy resin composites |
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