| 焊锡膏黏度的影响因素研究 |
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| 引用本文： | 秦俊虎,刘宝权,古列东,吕金梅.焊锡膏黏度的影响因素研究[J].电子元件与材料,2011,30(7):64-66. |
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| 作者姓名： | 秦俊虎 刘宝权 古列东 吕金梅 |
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| 作者单位： | 云南锡业股份有限公司,云南昆明,650217 |
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| 摘 要： | 黏度是焊锡膏的主要性能指标之一。研究了助焊剂含量、焊锡粉种类、焊锡粉粒度、温度等对其黏度的影响。结果表明：助焊剂的质量分数在9％～12％时，焊膏使用效果较好；温度对黏度的影响很大，每升高1℃，黏度降低约10 Pa·s，其他因素也不同程度影响着焊锡膏的黏度。
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| 关 键 词： | 焊锡膏 黏度 助焊剂 |
Research of influencing factors on solder paste viscosity |
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| QIN Junhu,LIU Baoquan,GU Liedong,L Jinmei.Research of influencing factors on solder paste viscosity[J].Electronic Components & Materials,2011,30(7):64-66. |
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| Authors: | QIN Junhu LIU Baoquan GU Liedong L Jinmei |
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| Affiliation: | QIN Junhu,LIU Baoquan,GU Liedong,L(U) Jinmei |
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| Abstract: | The viscosity is one of main performance indexes of solder pastes.The influences of the content of the flux,the type and the granularity of solder powders,the temperature etc.on the viscosity of the solder paste were studied.The results indicate that the use effect of the solder paste is good when the content of the flux is 9%~12%(mass fraction).The temperature shows a great very big influence on the viscosity.The viscosity is reduced by 10 Pa·s when the temperature is increased by 1 ℃.Other factors also influence the viscosity of the solder paste in various extents. |
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| Keywords: | solder paste viscosity flux |
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