| 基于电阻应变临界点的无铅焊点失效分析 |
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| 引用本文： | 蒋礼,刘方林,周孑民,陈晓敏,王天云.基于电阻应变临界点的无铅焊点失效分析[J].电子元件与材料,2009,28(7). |
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| 作者姓名： | 蒋礼 刘方林 周孑民 陈晓敏 王天云 |
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| 作者单位： | 1. 中南大学,物理学院,湖南,长沙,410083
2. 中南大学,能源学院,湖南,长沙,4110083 |
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| 基金项目： | 国家自然科学基金资助项目 |
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| 摘 要： | 利用特制的焊点在线测试系统,测试了不同载荷条件下单个无铅焊点的电阻应变曲线,推导出电阻应变和损伤量之间的定量关系式,分析了焊点失效特性。结果表明:无铅焊点电阻应变曲线包括线性变化区和指数变化区;两个区域临界点处的电阻应变值为0.05左右,临界点至失效的时间约占焊点寿命的20.00%～30.00%;热循环条件下,40℃的电阻应变曲线临界点滞后于125℃的临界点,滞后时间约占焊点寿命的7.50%。
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| 关 键 词： | 无铅焊点 失效 电阻应变 临界点 |
Failure analysis of lead-free solder joints based on resistance strain critical point |
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| JIANG Li,LIU Fanglin,ZHOU Jiemin,CHEN Xiaomin,WANG Tianyun.Failure analysis of lead-free solder joints based on resistance strain critical point[J].Electronic Components & Materials,2009,28(7). |
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| Authors: | JIANG Li LIU Fanglin ZHOU Jiemin CHEN Xiaomin WANG Tianyun |
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| Affiliation: | 1. School of Physics Science and Technology;Central South University;Changsha 410083;China;2. School of Energy and Power Engineering;China |
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| Abstract: | The failure properties of single lead-free solder joint were explored with resistance strain curve under different load conditions by a special-made solder joint on line electronic testing system, and the quantitate relationship formule between resistance strain and damage was deduced. The results show that resistance strain curves include a long time linear change period and a short time exponential change period. The resistance strain value at the critical point of the two periods is about 0.05, and the t... |
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| Keywords: | lead-free solder joint failure resistance strain critical point |
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