| 超临界流体在微电子器件清洗中的应用 |
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| 引用本文： | 李志义,刘学武,张晓冬,夏远景,胡大鹏.超临界流体在微电子器件清洗中的应用[J].洗净技术,2004,2(5):5-10. |
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| 作者姓名： | 李志义 刘学武 张晓冬 夏远景 胡大鹏 |
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| 作者单位： | 大连理工大学流体与粉体工程研究设计所,辽宁,116012 |
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| 摘 要： | 本文介绍了超临界流体及其特性、超，临界流体清洗工艺及特点。结合现有的研究结果，论述了在微电子加工中应用超临界流体的可行性和有效性。并以硅片的清洗和干燥为例，说明了超临界CO2的应用优势，指出了超临界流体在微电子技术中尚需要解决的技术问题及其广阔的应用前景。
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| 关 键 词： | 超临界流体 微电子器件 清洗 干燥 |
| 文章编号： | 1672-2248(2004)05-0005-06 |
Application of Supercritical Fluid in Microelectronics Cleaning |
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| Authors: | Li Zhi-yi Liu Xue-wu Zhang Xiao-dong Xia Yuan-jing Hu Da-peng |
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| Abstract: | An introduction is given to supercritical fluids and their unique properties, and to the process ofsupercritical fluid cleaning and its characteristics. The feasibility and efficiency of application of supercriticalfluids in microelectronics processing are analyzed with the present research results in this field. The ad-vantages of application of supercritical CO2 in wafer cleaning and drying are emphasized in details. Theprosperous prospects and the technical problems to be solved for the application of supercritical fluid inmicroelectronics processing are pointed out. |
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| Keywords: | Microelectronics Processing Supercritical Fluid Cleaning Drying |
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