|
|||||
|
|
| 基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究 | |
| 引用本文： | 梁颖,黄春跃,阎德劲,李天明.基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究[J].电子学报,2009,37(11):2520-2524. |
| 作者姓名： | 梁颖 黄春跃 阎德劲 李天明 |
| 作者单位： | 1. 成都航空职业技术学院,四川成都,610021 2. 桂林电子科技大学机电工程学院,广西桂林,541004 3. 中国西南电子技术研究所,四川成都,610036 4. 桂林航天高等专科学校科研与设备处,广西桂林,541004 |
| 基金项目： | 广西自然科学基金，广西制造系统与先进制造技术重点实验室主任基金 |
| 摘 要： | 叠层三维多芯片组件(3D Multi-Chip Module,MCM)芯片的位置布局直接影响其内部温度场分布,进而影响其可靠性.本文研究了叠层3D-MCM内芯片热布局优化问题,目标是降低芯片最高温度、平均芯片温度场.基于热叠加模型并结合热传导公式,选取芯片的温度作为评价指标,确定出用于3D-MCM热布局优化的适应度函数,采用遗传算法对芯片热布局进行优化,得出了最优芯片热布局方案,总结出了可用于指导叠层3D-MCM芯片热布局设计的热布局规则;采用有限元仿真方法,对所得的热布局优化结果进行验证,结果表明热布局优化结果与仿真实验结果一致,本文所提出的基于热叠加模型的MCM热布局优化算法可实现叠层3D-MCM芯片的热布局优化. |
| 关 键 词： | 叠层三维多芯片组件 遗传算法 热布局优化 热叠加模型 有限元分析 |
| 收稿时间： | 2008-09-06 |
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model |
|
| LIANG Ying,HUANG Chun-yue,YAN De-jin,LI Tian-ming.Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model[J].Acta Electronica Sinica,2009,37(11):2520-2524. | |
| Authors: | LIANG Ying HUANG Chun-yue YAN De-jin LI Tian-ming |
| Affiliation: | LIANG Ying1,HUANG Chun-yue2,YAN De-jin3,LI Tian-ming4(1.Chengdu Aeronautic Vocational and Technical College,Chengdu,Sichuan 610021,China,2.School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,Guilin,Guangxi 541004,3.Southwest China Institute of Electronic Technology,Sichuan 610036,4.Department of Science and Technology,Guilin College of Aerospace Technology,China) |
| Abstract: | In the thermal design of stacked three-dimensional multi-chip module(3D-MCM),the placement of multiple chips on 3D-MCM substrate has a significant effect on temperature field in the 3D-MCM,thus influences the reliability of the 3D-MCM.The thermal placement optimization of chips in stacked 3D-MCM was studied in this paper,the goal of this work is to decrease temperature and achieve uniform thermal field distribution within stacked 3D-MCM.The average temperature of chips in stacked 3D-MCM was chosen as the ev... |
| Keywords: | stacked 3D-MCM genetic algorithms thermal placement optimization thermal superposition model finite element analysis |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |
| 点击此处可从《电子学报》浏览原始摘要信息 | |
| 点击此处可从《电子学报》下载全文 | |