| 基于最小能量原理的SMT焊点三维形态预测 |
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| 引用本文： | 周德俭,潘开林,吴兆华,陈子辰.基于最小能量原理的SMT焊点三维形态预测[J].电子学报,1999,27(5):66-68. |
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| 作者姓名： | 周德俭 潘开林 吴兆华 陈子辰 |
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| 作者单位： | 1. 桂林电子工业学院电子机械系,桂林,541004
2. 浙江大学机械系,杭州,310027 |
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| 摘 要： | 本文应用最小能量原理和有限元方法建立表面组装技术（ＳＭＴ：Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｔｅｃｈｎｏｌｏｇｙ）形成的焊点三维形态预测模型，并运用该模型对塑料球栅阵列（ＰＢＧＡ：Ｐｌａｓｔｉｃ Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）器件焊点三维形态问题进行了预测和分析。最后将预测结果与试验结果以及国外学者用数学分析模型所得的预测结果进行了对比验证。
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| 关 键 词： | 表面组装技术 球栅阵列 焊点形态 最小能量原理 |
Predicting Three-Dimensional Solder Joint Shapes of SMT Based on Minimal Energy Principle |
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| Zhou Dejian,Pan Kailin,Wu Zhaohua,Chen Zichen.Predicting Three-Dimensional Solder Joint Shapes of SMT Based on Minimal Energy Principle[J].Acta Electronica Sinica,1999,27(5):66-68. |
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| Authors: | Zhou Dejian Pan Kailin Wu Zhaohua Chen Zichen |
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| Affiliation: | Zhou Dejian,Pan Kailin,Wu Zhaohua;
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| Abstract: | In this paper,minimal energy principle and finite element method were employed to develop solder joint shapes evolving model of PBGA.And three dimensional solder joint shapes of PBGA was predicted and analyzed.Comparisons were made between results predicted by the current model here and experimental measurements and those generated by mathematical analysis model at abroad. |
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| Keywords: | SMT BGA Solder joint shapes Minimal energy principle |
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