| 高Tc超导互连线高频传输特性分析 |
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| 引用本文： | 康晋锋,韩汝琦.高Tc超导互连线高频传输特性分析[J].电子学报,1996,24(11):105-107. |
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| 作者姓名： | 康晋锋 韩汝琦 |
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| 作者单位： | 北京大学微电子所 |
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| 摘 要： | 利用能较好描述高温超导体反常温度特征的推广二流体模型和传输线理论，计算和模拟了用于ＶＬＳＩ封装互连的高温超导互连线的传输常数随温度的变化关系和上升时间对温度及互连线宽度与长度的依赖关系。
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| 关 键 词： | 高温超导 VLSI 互连 传输常数 上升时间 传输线 |
Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing |
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| Kang Jinfeng,Han Ruqi,Wang Yangyuan.Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing[J].Acta Electronica Sinica,1996,24(11):105-107. |
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| Authors: | Kang Jinfeng Han Ruqi Wang Yangyuan |
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| Abstract: | The propagation constant and rise time of High-Tc superconducting interconnect for VLSI packaging are calculated and simulated by using a generalized two-fluid model and transmission line theory.Meanwhile,the temperature dependences of attenuation constant and phase velocity as well as the rise time based on the generalized two-fluid model are compared with those based on conventional two-fluid model.The limitation of the later is indicated.Our results could be used in the VLSI system CAD. |
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| Keywords: | High-T_c superconductor Interconnect for VLSI packing Propagation constant Rise time VLSI system CAD |
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