Robust snubberless soft-switching power converter using SiC power MOSFETs and bespoke thermal design |
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| Affiliation: | 1. Power Electronics, Machines and Control Group, University of Nottingham, Nottingham NG7 2RD, UK;2. Department of Information Engineering, University of Parma, Viale G.P. Usberti, 181/A, 43124 Parma, Italy;1. IMS-Bordeaux, Université de Bordeaux – UMR 5218, 351 cours de la Libération, 33405 Talence, France;2. Information Technology Laboratory, Gottfried Wilhelm Leibniz Universität Hannover, Hannover, Germany;1. Semiconductor Devices Division, Berlin University of Technology, Berlin, Einsteinufer 19, 10587 Berlin, Germany;2. French Space Agency (CNES), Toulouse, France;3. Hamamatsu Photonics Deutschland, Herrsching, Germany;1. Le2i, UMR CNRS 6306, University of Burgundy, 9 Avenue Alain Savary, 21000 Dijon, France;2. Centre National d’Etudes Spatiales (CNES), 18 Avenue Edouard Belin, 31401 Toulouse, France;1. STMicroelectronics, 850, rue Jean Monnet, 38926 Crolles Cedex, France;2. Laboratory of Computer Sciences, Paris 6 (LIP6), Systems On Chips Department, UPMC University, 4 place Jussieu, 75252 Paris Cedex 05, France;1. University of Vienna, Physics of Nanostructured Materials, Vienna, Austria;2. Materials Center Leoben Forschung GmbH, Leoben, Austria;3. Vienna University of Technology, Faculty of Technical Chemistry, Vienna, Austria;1. Engineering Product Development Pillar, Singapore University of Technology and Design, Singapore 138 682, Singapore;2. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA |
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| Abstract: | A number of harsh-environment high-reliability applications are undergoing substantial electrification. The converters operating in such systems need to be designed to meet both stringent performance and reliability requirements. Semiconductor devices are central elements of power converters and key enablers of performance and reliability. This paper focuses on a DC–DC converter for novel avionic applications and considers both new semiconductor technologies and the application of design techniques to ensure, at the same time, that robustness is maximized and stress levels minimized. In this respect close attention is paid to the thermal management and an approach for the heatsink design aided by finite element modelling is shown. |
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| Keywords: | SiC devices DC–DC converter Thermal management |
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