| 塑封GaAs MMIC的失效机理及典型案例 |
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| 引用本文： | 李萍,黄云,郑廷圭,施明哲.塑封GaAs MMIC的失效机理及典型案例[J].电子产品可靠性与环境试验,2007,25(6):8-10. |
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| 作者姓名： | 李萍 黄云 郑廷圭 施明哲 |
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| 作者单位： | 信息产业部电子第五研究所,广东,广州,510610 |
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| 摘 要： | 阐述了塑封GaAs MMIC的主要失效模式和失效机理,根据40余例实际案例,得出了其使用中的失效机理分布,并给出几例典型的失效分析案例.
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| 关 键 词： | 微波单片集成电路 失效模式 失效机理 分析案例 |
| 文章编号： | 1672-5468（2007）06-0008-03 |
| 收稿时间： | 2007-06-12 |
| 修稿时间： | 2007-11-14 |
Failure Analysis of Plastic Encapsulated GaAs MMICs |
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| LI Ping,HUANG Yun,ZHENG Ting-gui,SHI Ming-zhe.Failure Analysis of Plastic Encapsulated GaAs MMICs[J].Electronic Product Reliability and Environmental Testing,2007,25(6):8-10. |
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| Authors: | LI Ping HUANG Yun ZHENG Ting-gui SHI Ming-zhe |
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| Abstract: | The main failure modes and failure mechanisms of plastic encapsulated GaAs MMICs are described in this paper. Based on about 40 practical cases, the distribution of the failure mechanisms in use is obtained. Finally, several typical failure analysis cases are introduced. |
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| Keywords: | MMIC failure mode failure mechanism analysis case |
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