| 高速PCB的地线布线设计 |
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| 引用本文： | 于治楼,杜光芹.高速PCB的地线布线设计[J].信息技术与信息化,2009(2). |
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| 作者姓名： | 于治楼 杜光芹 |
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| 作者单位： | 浪潮集团有限公司,济南,250100 |
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| 摘 要： | 本文针对高速PCB板信号接地设计中存在接地噪声及电磁辐射等问题,提出了高速PCB接地模型,并从PCB设计中布线策略的分析和去耦电容的使用等几个方面讨论了解决高速PCB板的接地噪声和电磁辐射问题的方法.
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| 关 键 词： | 高速电路板 电磁兼容 抗干扰 去耦电容 |
The Ground Layout Design of High-Speed PCB |
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| YU Zhi-lou,DU Guang-qin.The Ground Layout Design of High-Speed PCB[J].Information Technology & Informatization,2009(2). |
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| Authors: | YU Zhi-lou DU Guang-qin |
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| Abstract: | Because of the existence of the ground noise and the electromagnetic radiation in the high-speed PCB board design, this paper proposes a simple ground model in high-speed PCB board design, and discusses the solution to solve the ground noise and the electromagnetic radiation in the high-speed PCB board design from the aspects in analysis of wiring strategy and the use of capacitive coupling. |
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| Keywords: | High-Speed PCB EMC Resist noise Decoupling capacitors |
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