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Technology innovation and process integrations for sub-100nm gate patterning |
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| Authors: | Meihua Shen Wilfred Pau Nicolas Gani Jianping Wen Shashank Deshmukh Thorsten Lill Jian Zhang Hanming Wu Guqing Xing |
| Abstract: | This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration. |
| Keywords: | patterning gate process innovation multilayer film etching roughness focus issues studies chemistry integration impact successful development emphasis tuning capability uniformity control |
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