电子组件温度循环试验研究

为了使温度循环试验在有效提高电子组件的可靠性方面得以广泛应用,基于温度循环试验的机理,对电子组件温度循环试验的关键参数(温度范围、循环次数、保持时间、温变速率、风速)进行了探讨,给出了这些参数的工程经验选取值。在此基础上,借助热分析软件分析了温变速率、保持时间和风速三个参数对试验过程的影响并定性分析了三个参数间的关系。最后,提出了进行温度循环试验时应注意的问题,强调科学、正确地执行温度循环试验的重要性。

Research of Temperature Cycle Test for Electronic Assemblies

In order to make the temperature cycle test be widely used in effectively improving the reliability of electronic assemblies,based on the mechanism of temperature cycle test,the critical parameters(temperature range,number of cycles,dwell time,temperature rate of change and airflow velocity) of temperature cycle test for electronic assemblies were discussed.And the engineering experience values of these parameters were given.Based on this,the influences of temperature rate of change,dwell time and airflow v...