基于像素分布特性的IC晶片视觉检测方法

IC晶片制造过程存在多种致命缺陷,致使芯片失效,导致成品率下降.冗余物缺陷是影响IC晶片成品率下降的重要原因,主要造成电路短路错误.针对冗余物缺陷对版图的影响,提出了一种简单可行的缺陷视觉检测方法,以实现冗余物缺陷的识别及电路失效形式的确定.根据摄取的显微图像的图像特征,利用光线补偿技术及形态滤波方法消除干扰噪声,以提高图像质量,采用投影定理及基于像素分布特性的检测方法,实现电路短路形式或缺陷未导致电路失效的识别.

Method of Vision Inspection for IC Wafer based on Character of Pixels Distribution

There are many vital defects in the process of IC wafer fabrication,leading chips to lose their own function and resulting to reduce the yield of IC. The redundancy material defect is an important factor of reducing the yield of IC,it mainly causes circuits to be connection failure.A simple and doable method of vision inspection for the redundancy material defect was presented aiming at the effects on IC wafer design,in order to recognize the redundancy material defect and ascertain circuit failure style.According to the image character of taken micrographs,to improve image quality,the method of ray equalization and configuration filter was used to eliminate the disturbed yawp.Then,the projection theorem and the inspection method based on character of pixels distribution were used to recognize the connection circuits and the circuits of no loosing function.