| 微装配技术的研究进展及其展望 |
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| 引用本文： | 尹周平,熊有伦.微装配技术的研究进展及其展望[J].半导体技术,2004,29(5):6-9,15. |
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| 作者姓名： | 尹周平 熊有伦 |
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| 作者单位： | 华中科技大学机械科学与工程学院,湖北,武汉,430074;华中科技大学机械科学与工程学院,湖北,武汉,430074 |
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| 基金项目： | 国家重点基础研究发展计划(973计划)
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国家自然科学基金 |
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| 摘 要： | 微装配是电子制造、微制造、机器人操作等制造领域的共性前沿技术之一,近年来得到了广泛的研究与应用.首先,指出了微装配技术与纳米装配技术的本质区别,阐明了尺度效应和粘附效应给微装配技术带来的问题与挑战;分别介绍了传统微装配技术和新兴自装配技术的最新研究进展,讨论了一些急待解决的关键技术问题;最后对微装配技术的研究趋势进行了展望.
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| 关 键 词： | 微装配 自装配 粘附效应 |
| 文章编号： | 1003-353X(2004)05-0006-04 |
Research progress and trends of microassembly technology |
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| YIN Zhou-ping,XIONG You-lun.Research progress and trends of microassembly technology[J].Semiconductor Technology,2004,29(5):6-9,15. |
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| Authors: | YIN Zhou-ping XIONG You-lun |
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| Abstract: | As one of the common frontier technology of IC manufacturing, micro-manufacturing,and robot manipulation, microassembly and micromanipulation have been researched widely recently.At first, this paper points out the inherent difference between microassembly and nanoassembly,and presents the new problems and challenges for microassembly due to effects of down-scaling andstick effects. Then, the latest research progresses of traditional microassembly technology and emerg-ing self-assembly technology are introduced, where some key technical problems are discussedbriefly. Lastly, the paper concludes with some open problems and future trends of microassembly. |
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| Keywords: | microassembly self-assembly stick effects |
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