凸点晶圆测试共性问题研究与应用

集成电路"轻、薄、小"的趋势使新封装技术在产业中不断得以应用。晶圆凸点工艺作为新封装技术的关键工序尤为重要,相应的凸点晶圆测试方案是产业面临的现实问题。针对凸点晶圆测试中出现的新问题和技术难点,结合在多个凸点晶圆测试开发和量产过程中积累的成功经验,按照晶圆测试控制流程,依次阐述在凸点晶圆测试中碰到的共性问题,如针对凸点晶圆测试的新型探针卡及测试过程中针压控制、凸点损伤与量产测试中关键操作控制、在线清针与检查、工艺数据测试衔接等。并提供预防凸点损伤的过冲控制参数自动获取解决方案和凸点晶圆并行测试解决方案,实现凸点晶圆可靠的量产测试,有效提高了凸点晶圆的测试能力。

Research and Application of Common Issues for the Bump Wafer Test

For the "light,thin,compact" IC trend,the new packaging technology is applied continuous in IC industry.While the wafer bumping process is the key process of the new packaging technology,the bump wafer test is a real problem of the industry.For the new problems and technical difficulties from bump wafer test,combine with the successful experiences of multiple bump wafer test development and production test,in accordance with the wafer test control process,the common problems encountered in the bump wafer test were discussed.The common issues consist of the new probe cards and over drive control during bump wafer test,the bump damage and the critical operating control of the production test,the online needle cleaning and checking,the process data for testing.The overshoot control parameters for bump injury prevention were provided,and its solutions were obtained automatically,and the solutions of bump wafer parallel test were also obtained.The reliable bump wafer production test was achieved,and the bump wafer test capability was improved effectively.