功率微电子封装用铝基复合材料

微电子技术的发展对电子封装提出了更高的要求，现有封装材料在性能方面存在局限性，已无法全面满足现代及下一代电子产品的要求，因此，新型金属基复合材料（MMC）应运而生，其中最有前景的封装材料是AI／SICo本文根据近几年国际上报导的有关资料，对Al/SiC的性能、制造工艺及封装制造途径进行了综述，提出了在我国开展这方面工作的建议。

Al-based Composite Materials for Power Microelectronic Packages

Higher demands are imposed on electronic packages as microelectronic technolo-technology is evolving. Constraints exist in traditional packaging materials in terms of properties.They cannot fully satisfy the demands of existing and future electronic products. New metalmatrix materials (MMC) were developed, among which Al/SiC is a most promising package material. This paper reviews Al/SiC properties, manufacturing process and packagefabrication ways based on relevant information recently published, and points out sugges to conduct this study in our country.