红外面阵探测器DTDI技术的性能分析

戽链（BBD）结构的CMOS红外模拟TDI探测器，由于其兼容普通CMOS工艺，并可以提高系统的信噪比，因而在空间遥感领域得到了广泛的应用。而基于焦平面面阵的数字TDI（Digital Time Delay and Integration）技术的研究与应用尚在起步阶段。利用中国生产的320256中波面阵红外探测器进行DTDI研究，对比分析了模拟TDI探测器的电子转移效率、BBD噪声、动态范围等方面的性能，突出了DTDI在结构和性能上的优势，并通过理论推导了DTDI对面阵探测器本身信噪比的提高，非均匀性的改善，同时分析了DTDI过程中盲元对性能的影响。最后，通过实验得到了16级DTDI的信噪比增加为2.5倍，非均匀性减少到1.68%，验证了DTDI技术对系统性能的改善，为DTDI技术的应用提供了理论参考。

Performance of DTDI technology based on IRFPA detector

The CMOS TDI of infrared detector based on bucket-brigade device (BBD) structure, has been widely used in the field of space remote sensing, it can compatible with the general CMOS process, and improve the signal-to-noise ratio (SNR) of the system. Compare with the analog TDI, the Digital Time Delay and Integration (DTDI) based on the infrared focal plane array is still in the initial stage. In this paper, the 320256 MWIR FPA was used to do the DTDI research, and the electron transfer efficiency, the BBD noise and the dynamic range of the analog TDI was in a detail analysis to compare with DTDI. And the NU and blind pixel were also taken into consideration to analysis the DTDI performance. Finally in the experiment, the SNR can be increased to 2.5 times and the NU can be reached 1.68% after the 16-stage DTDI was used, which verify the improvement of the system performance by using DTDI technique.