一种拼接结构红外探测器的封装电学设计

随着红外焦平面探测器技术日趋成熟，由多片红外探测器组成更大规模探测器的需求也更为广泛。红外探测器往往采用多片拼接结构，达到扩大探测器阵列规模的目的。从2×2,3×3到4×4甚至更大规模的拼接结构，其拼接设计的核心均为封装结构设计。在封装结构设计中，如何进行电学引出设计，也是设计中非常重要的一个环节。文章介绍了一种红外探测器拼接结构的封装电学设计，首先介绍拼接结构的概况，然后介绍为满足该种结构的电学设计采用的结构方案，最后介绍针对该种电学设计结构方案进行的电学布线设计。

Package electrical design of splicing structure infrared detectors

With the increasing maturity of infrared focal plane detector technology,the need for larger detectors made up of multiple infrared detectors is becoming more widespread.Infrared detectors often use splicing structure to achieve the purpose of expanding the size of the detector array.From 2×2,3×3 to 4×4 or even larger focal plane array size,the key of splicing design is the package structure.The design of the package structure is also a very important part of the design in terms of how to perform the electrical lead out design.In this paper,the electrical design of an infrared detector with a splicing structure is introduced.The overview of the splicing structure,the structural scheme used to meet the electrical design of the structure,and the electrical wiring design for the structural scheme of the electrical design are presented.