高功率光纤激光器光纤器件封装应力影响研究

高功率激光器无源器件制作过程中封装不当引入的应力,会导致信号光光束质量劣化和光纤温升,为了解决此问题,理论分析了光纤形变对信号光模式分布的影响,利用有限元方法建立包层光导致光纤发热模型,实验研究了不同封装方式对光纤发热情况和信号光光束质量的影响。实验表明,应力导致的光纤形变会造成信号光M^2值在受力方向上略微变小而其垂直方向上变大,在输出100W信号光时,施加应力导致的M^2值的变化最高为0.39,与仿真结果相符。在光纤温升方面,相比于使用硬质胶水带来的12℃温升,使用硅橡胶封装的剥离器将温升控制在5℃以内,且其封装应力引入的M^2值的变化在0.05以内。

Study on stress effect of fiber devices in high-power fiber laser

In high power fiber lasers,the mechanical stress on optical fiber will lead to deterioration of laser beam quality and temperature rising of optical fiber.To solve the problem,the influence of optical fiber deformation on the mode distribution of signal light is analyzed theoretically.The heating model of fiber is established.The effects of stress on optical fiber heating and laser beam quality are studied by experiment.The results show that stress induced optical fiber deformation will cause directional changes in beam quality.The M^ 2 value decreases slightly in the direction of force and becomes larger in the vertical direction.When output is 100 W,the maximum change of M^2 value caused by stress is 0.39 and the maximum temperature rise caused by stress is 12 ℃.The temperature rise of the CPS using silastic is controlled within 5 ℃ and the M^2 value caused by stress is controlled within 0.05.