崩角问题分析探讨

在集成电路封装过程中，L（T）QFP／PQFP系列产品在胶体四角进浇口、排气槽位置的崩角问题已直接影响到封装成品率和产品可靠性。本文展现了崩角的几种现象，对出现的原因进行了分析，并提出了通过改善模具的凸凹模结构、改善框架冲切方向（反冲、胶体支撑）、优化塑封料特性、改进塑封模具等都可不同程度的改善崩角。综合考虑方案的可行性、经济性、方便性诸因素，选择最优化的途径，使解决崩角问题达到最佳效果。

Issue Analysis and discussion on Packag Corner Chipping

In the process Assembly, the Package-chipping issue of air vent where four corners of LQFP and QFP series products enter the mold gate has directly impacted the assembly yield and the reliability of the product. This report will introduce several phenomena and provide a basic analysis about the cause. Also the way to solve the issue of package -chipping ,such as improving the structure of molding tooling design, lead frame, the direction of D/T （ Such as inverted punch and body supporting ）, promoting the characteristic of the compound and molding tooling wilt be shared. After comprehensively considering whether they are available, economical and workable, the best way will be selected to perfectly solve the package -chipping issue