退火处理对锑化铟MIS器件C-V特性的影响

采用原子层沉积技术制备Al2O3薄膜作为InSb材料介电层,制备了MIS器件,研究了金属化后不同退火温度对界面特性的影响.利用C-V测试表征了MIS(metal-insulator-semiconductor)器件的界面特性,结果表明Al2O3介电层引入了表面固定正电荷,200℃和300℃退火处理可有效减小慢界面态密度...

Effect of Annealing on C-V Characteristics of InSb Metal-Insulator-Semiconductor Devices

An Al₂O₃ film was prepared as a dielectric layer for an InSb material via the atomic layer deposition technique, the MIS device was developed, and the effects of annealing temperature on the post-metallization interfacial characteristics were investigated. Moreover, the interface of the MIS device was characterized using the C-V test. The results indicate that the Al₂O₃ dielectric layer introduced surface-fixed positive charges, and annealing processing at 200 and 300℃ can effectively reduce the slowing density. Furthermore, Terman's method can be used to obtain the interface states density distribution. This indicates that 200℃ annealing can significantly decrease the interfacial density close to the center of the bandgap and the conduction band. Additionally, negative charges being trapped near the interface of the Al₂O₃ dielectric layer is found to be the main cause of C-V curve hysteresis. Experiments prove that an annealing process at 200℃?300℃ can effectively improve the InSb/Al₂O₃ interface quality.