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双栅氧CMOS工艺研究
引用本文:李桦,宋李梅,杜寰,韩郑生.双栅氧CMOS工艺研究[J].微电子学与计算机,2005,22(11):5-6,9.
作者姓名:李桦  宋李梅  杜寰  韩郑生
作者单位:中国科学院微电子研究所,北京,100029
摘    要:双栅氧工艺(dual gate oxide)在高压CMOS流程中得到了广泛的应用,此项工艺可以把薄栅氧器件和厚栅氧器件集成在同一个芯片上.文章介绍了常用的两种双栅氧工艺步骤并分析了它们的优劣.在此基础上,提出了一种实现双栅氧工艺的方法.

关 键 词:双栅氧工艺  高压CMOS流程
文章编号:1000-7180(2005)11-005-02
收稿时间:2005-07-28
修稿时间:2005-07-28

Study of Dual Gate Oxide Technology in CMOS Process
LI Hua,SONG Li-mei,DU Huan,HAN Zheng-sheng.Study of Dual Gate Oxide Technology in CMOS Process[J].Microelectronics & Computer,2005,22(11):5-6,9.
Authors:LI Hua  SONG Li-mei  DU Huan  HAN Zheng-sheng
Affiliation:Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029
Abstract:The dual gate oxide(DGO) technology has been widely used in high-voltage CMOS process, it can integrate both thick gate oxide device and thin gate oxide device in a same chip. Two commonly used technologies are introduced and the advantages and disadvantages of them are discussed. Based on the results a new way to fabricate DGO is proposed in this paper.
Keywords:Dual gate oxide  High-voltage CMOS process
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