| 电子封装用金属基复合材料的研究现状 |
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| 引用本文： | 黄强,顾明元.电子封装用金属基复合材料的研究现状[J].电子与封装,2003,3(2):22-25. |
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| 作者姓名： | 黄强 顾明元 |
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| 作者单位： | 1. 中国电子科技集团公司第58研究所,江苏,无锡,214005
2. 上海交通大学金属基复合材料国家重点实验室,上海,200030 |
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| 摘 要： | 微电子技术的飞速发展也同时推动了新型封装材料的研究和开发。本文综述了电子封装用金属基复合材料的研究和发展状况,并以A1/SiCp为重点,分析对比了目前国内外的差距,提出了其未来的发展趋势及方向。
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| 关 键 词： | 电子封装 金属基复合材料 Al/SiCp |
| 修稿时间： | 2002年12月23 |
Status and Prospects of Metal Matrix Composites for Electronic Packaging |
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| HUANG Qiang,GU Ming-yuan.Status and Prospects of Metal Matrix Composites for Electronic Packaging[J].Electronics & Packaging,2003,3(2):22-25. |
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| Authors: | HUANG Qiang GU Ming-yuan |
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| Abstract: | The rapid development of microelectronic technology has been giving impetus to the development of new electronic packaging materials.The progress of metal matrix composites for electronic packaging is sum marized in this paper.Status and progress on A1/ SiCp in the world and China are also reviewed.The up-to -date trends are discussed and the future research directions are suggested. |
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| Keywords: | Electronic packaging Metal matrix composite A1/SiCp |
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