首页 | 本学科首页   官方微博 | 高级检索  
     

金属封装材料的现状及发展
引用本文:童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005,5(3):6-15.
作者姓名:童震松  沈卓身
作者单位:北京科技大学材料科学与工程学院,北京,100083
摘    要:本文介绍了在金属封装中目前正在使用和开发的金属材料。这些材料不仅包括金属封装的壳体或底座、引线使用的金属材料,也包括可用于各种封装的基板、热沉和散热片的金属材料。为适应电子封装发展的要求,国内开展对金属基复合材料的研究和使用将是非常重要的。

关 键 词:金属封装  底座  热沉  散热片  金属基复合材料
文章编号:1681-1070(2005)03-06-10

Status and Development of Materials for Metal Packaging
Tong Zhen-song,Shen Zhuo-shen.Status and Development of Materials for Metal Packaging[J].Electronics & Packaging,2005,5(3):6-15.
Authors:Tong Zhen-song  Shen Zhuo-shen
Abstract:Metallic materials used and developed at present in metal packaging were introduced in this paper, which not only included that of the housings or bases, leads used for metal packaging, but also included that of the substrates, heat sinks and heat spreaders applied in various types of packagings. It is very important to research and apply the metal matrix composites for us in order to meet increasing requirements of electronic packagings.
Keywords:Metal packaging Base Heat sink Heat spreader Metal matrix composites
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号