平行缝焊与盖板

在一些特殊环境条件下使用的各种电子元器件，需要进行密封封装，以防止器件中的电路因潮气、大气中的离子、腐蚀气氛的浸蚀等引起失效。另外在封装时可以充以保护气体来降低封装环境湿度，进行气密性封装以延长器件的使用时间。文章通过在SSEC（Solid State Equipment Company）M-2300型平行缝焊机上进行缝焊实验发现，盖板与平行缝焊的关系是相当重要的。在管座性能稳定的情况下，盖板质量的好坏直接影响着器件的气密性。

Parallel Seam Welding and Lids

Various electronic components using under some special environment conditions, need to seal pack-age to prevent failures of the electric circuit in it because of the etching of the dampness, the ion in atmosphere, decay atmosphere and etc. The use time of components can be extended by hermetic sealing to lower the environment degree of humidity with the protection air.Through experiment on the SSEC(the Solid State Equipment Company)M-2300 parallel seam sealer the results are foud:The lids’quality is very important. While the function of the tube socket is stable, the quality of lids influences the hermeticity of devices directly.