| 基于晶圆级封装技术的声表面波滤波器 |
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| 引用本文： | 王祥邦,刘敬勇,李勇.基于晶圆级封装技术的声表面波滤波器[J].电子与封装,2019,19(7):1-3,32. |
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| 作者姓名： | 王祥邦 刘敬勇 李勇 |
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| 作者单位： | 中国电子科技集团公司德清华莹电子有限公司,浙江德清,313200;中国电子科技集团公司德清华莹电子有限公司,浙江德清,313200;中国电子科技集团公司德清华莹电子有限公司,浙江德清,313200 |
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| 摘 要： | 描述了一种基于晶圆级封装的超小型声表面波滤波器,采用载板通孔的方式实现了从芯片到滤波器的输出,最终产品的尺寸和芯片尺寸一致,产品部分性能优于传统封装滤波器,为实现将声表面波滤波器和PA、开关等射频器件整合成为模块奠定了基础。
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| 关 键 词： | 声表面波滤波器 晶圆级封装 基板 晶圆 |
Surface Acoustic Wave Filters Based on Wafer Level Chip Scale Package |
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| WANG Xiangbang,LIU Jingyong,LI Yong.Surface Acoustic Wave Filters Based on Wafer Level Chip Scale Package[J].Electronics & Packaging,2019,19(7):1-3,32. |
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| Authors: | WANG Xiangbang LIU Jingyong LI Yong |
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| Affiliation: | (CETC Deqing Huaying Electronics Co.,Ltd.,Deqing 313200,China) |
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| Abstract: | A kind of subminiature surface acoustic wave(SAW) filter based on wafer level package is described. By the means of making a through-hole on substrate, the output from chip to SAW filter is realized. The sizes of the final product and the chip are the same. The performance is better than that of the traditional chip scale package filter, which lays a foundation for integrating the SAW filter with PA, switch and other radio frequency devices into a module. |
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| Keywords: | surface acoustic wave filters wafer level chip scale package substrate wafer |
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