电子封装面临无铅化的挑战

随着环境污染影响人类健康的问题已成为全球关注的焦点,电子封装业面临着向“绿色”无铅化转变的挑战,采用无铅封装材料是电子封装业中焊接材料和工艺发展的大势所趋。本文主要介绍了电子封装无铅焊料以及其他辅助材料的研究现况,并对无铅BGA封装存在的可靠性问题进行了讨论,进而指出开发无铅材料及工艺要注意的问题和方向。

The Challenge of changeover to Lead-free in Electronic Packaging

As environment pollution and health problem became more and more seriously concerned, the electronic packaging industry is facing the challenge of changeover to "green", and using the lead-free material is the trend of the electronic packaging technology. This paper will introduce several lead-free solder materials and other correlated auxiliary materials, and discusses the reliability issues of lead-free BGA packaging, in order to demonstrate the problems and tendency on the development of being lead-free packaging.