高导热聚合物基复合封装材料及其应用

微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求,将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。文章结合高导热环氧塑封材料的研究工作,评述了高热导聚合物基复合封装材料的材料体系、性能特点和在微电子封装中的应用情况。分析讨论了影响聚合物基复合电子封装材料导热性能和介电性能的因素,提出了进一步提高聚合物基复合电子封装材料导热性能的途径。

Electronic Packaging Technology and Polymer-based Composite Packaging Materials

Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing. Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers, and can be used as electronic packaging materials. Companying with research in highly thermal conductive epoxy packaging materials, material system, performance and applicabil- ity in electronic packaging of polymer composite are discussed respectively. Factors which influence the thermal conductance and dielectric property of such kind of composite packaging materials are analyzed. Several methods for improving the thermal conductive performance of these composites are discussed.