| 激光微熔覆柔性布线系统研究及应用 |
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| 引用本文： | 李祥友,李耀兵,刘冬生,曾晓雁.激光微熔覆柔性布线系统研究及应用[J].应用激光,2004,24(5):258-260. |
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| 作者姓名： | 李祥友 李耀兵 刘冬生 曾晓雁 |
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| 作者单位： | 华中科技大学激光技术国家重点实验室,武汉,430074 |
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| 基金项目： | 国家自然科学基金项目(50075030)， 国家”863”项目(2001AA421290) |
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| 摘 要： | 介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。最后 ,展示了利用该系统制备的线路板的实例
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| 关 键 词： | 线路板制备 激光微熔覆 系统组成 |
Study of Laser Micro-Cladding System to Circuit Boards Fabrication |
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| Li Xiangyou,Li Yaobing,Liu Dongsheng,Zeng Xiaoyan.Study of Laser Micro-Cladding System to Circuit Boards Fabrication[J].Applied Laser,2004,24(5):258-260. |
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| Authors: | Li Xiangyou Li Yaobing Liu Dongsheng Zeng Xiaoyan |
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| Abstract: | A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper. According to its characteristics, the laser direct fabrication system was designed and manufactured. Corresponding hardware and software were described in detail. Finally, some applications of this system were presented. |
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| Keywords: | Circuit board fabrication laser micro-cladding system setup |
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